Electronic firms can increase their capabilities of electronics devices while reducing their power consumption at the same time – size. Expertise in miniaturization technologies, material science and nano-micro electronics collectively enable us to access hard to reach technological areas such as semiconductor processing, micro-machining, nano-micro lithography, MEMS, software enabled hardware’s, device development, chip packaging etc.

Sensor for structural durability:

“Tiny, sensitive sensors sound the alarm when they detect wear and tear on the tiniest machine parts”

Extremely sensitive sensensor-chip-semiconductorsor technology offers solutions for the analysis of structural durability of fiber composite components, process and condition monitoring of machines, dynamic handling processes, highly loaded components, expendable parts and composite structures. Sensors, due to their extremely good signal-to-noise ratio are able to let machines and components “feel” and monitor their “integrity”.

As a result, sensors can even detect acoustic emissions, vibrations and the tiniest material changes such as stretching, which would easily be drowned out by interfering noise signals using other sensors. Sensors also cover the enormous bandwidth of 0.01Hz to 500 kHz, which is the entire range of frequencies that are relevant for monitoring gear units and bearings.  The analyzed sensor data can then be used to draw conclusions about the condition of car transmissions, aircraft turbines and production machines. Early detection through sensor can save and prolong “lives” of industrial equipment’s. That is because once a defined wear limit is reached, of the component goes to be maintained or repaired before more extensive damage is done or there is a production shutdown.


Micro-contaminlithographyation has become a serious problem in the semiconductor-manufacturing process, as well as in other areas of high-precision optics. It has already had a significant impact on the cost of ownership and life expectancy of photomasks and optical elements for advanced lithography.

The movement towards new innovations in Lithography, such as EUVL (Extreme Ultra-Violet Lithography) technology brings new hope for vacuum tight-contamination free processing. EUVL allows higher resolution, in combination with a larger process window and design freedom, resulting in better performing chips, as well as presents significant cost savings as compared to immersion techniques with triple patterning.

The movement towards 450mm wafers presents its own set of challenges. The larger wafers for batch manufacturing require new processes and equipment’s where cost control is a key concern. EUVL allow complex parts designing as close to 10 nano-meters while reducing the chances of contamination in batch processing.How did you like our views on the semiconductor industry ? Leave us your views in comments below!

Did you enjoy this article?
Signup today and receive free updates straight in your inbox. We will never share or sell your email address.
Liked this Blog? Then Please ShareTweet about this on Twitter
Share on Facebook
Share on LinkedIn
Email this to someone